The SiC-on-insulator (SiCOI) is a next-generation semiconductor material structure that places a thin layer of silicon carbide (SiC) over an insulating layer, typically silicon dioxide. This design allows engineers to combine the high-performance traits of SiC — such as thermal conductivity, breakdown voltage, and electron mobility with the benefits of electrical isolation. The result is a film that delivers superior power efficiency, speed, and reliability compared to traditional silicon wafers.
According to BIS Research, The SiC-on-Insulator (SiCOI) film market is set for explosive growth rising from just $22.1 million in 2023 to over $4.3 billion by 2034. With a staggering 64.13% CAGR, this surge is fueled by growing demand for faster, more efficient electronics in EVs, 5G, and advanced industrial systems.
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While the core strength of the SiC-on-insulator film market lies in its material science, its commercial growth is being driven by practical use cases across industries:
• Power Devices benefit from better thermal handling and energy efficiency.
• RF Devices gain improved signal integrity and lower losses critical for 5G and radar.
• MEMS (Micro-Electro-Mechanical Systems) see enhanced precision and durability.
• Photonic Devices use SiCOI to support faster, more integrated optical components.
• Other applications span aerospace systems, automotive electronics, and nanotechnology platforms.
These use cases highlight the broad relevance of high-performance semiconductor materials, especially in sectors like electronics, automotive, and aerospace.
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The substrate material product market is at the heart of SiCOI innovation. Substrates serve as the foundation for these films and heavily influence their electrical, thermal, and mechanical properties. Within this space, the SiC-on-insulator film market intelligence is centered around three major substrate types:
These are designed for high-frequency, high-isolation applications — particularly in RF and communication systems. The semi-insulating nature helps eliminate unwanted current paths, improving signal clarity and reducing noise in advanced circuits. They’re essential in developing RF devices that power everything from 5G infrastructure to satellite comms.
Conductive substrates are built for power. Used in devices that handle high voltage and current such as power inverters and EV drive trains, they offer excellent electron mobility and heat dissipation. These materials are critical in achieving efficiency and longevity in high-stress environments like automotive powertrains and industrial energy systems.
And some Other Substrate Materials, which includes emerging hybrid and engineered substrates tailored to specific functions in nanotechnology, photonics, and custom chip design. These fall under broader SiC classifications and support niche innovations where standard substrates fall short.
As the SiCOI film market matures, these materials will define how well devices perform, how small they can get, and how efficiently they operate. Understanding SIC codes and matching the right substrate to the right application is becoming a core strategic decision for manufacturers.
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In March 2025, Soitec announced advancements in its silicon photonics technology, aiming to accelerate the development of integrated optical connectivity solutions for AI data centers. This initiative underscores Soitec's commitment to enhancing semiconductor materials for high-performance applications.
In early 2025, Wolfspeed introduced its fourth generation SiC MOSFET technology platform. This new platform is designed to improve system efficiency and prolong application life, even in the harshest environments, catering to high-power automotive, industrial, and renewable energy systems.
NGK Insulators has been focusing on developing high-performance next-generation wafer products. Utilizing their proprietary crystal growth method, ultra-precision-polishing technology, and multi-materials bonding technology, NGK aims to produce SiC wafers that improve reliability and lower the cost of power devices used in electric vehicles and other applications.
These 2025 advancements reflect a growing momentum in the SiC-on-insulator ecosystem, where innovation across substrates and power devices is redefining performance standards for next-gen electronics and AI infrastructure.
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The SiC-on-insulator film market is not just about materials, it’s about solving real problems in performance, power, and scale. Substrate innovation, particularly around semi-insulating and conductive SiC substrates, is the key to unlocking the full potential of these films. As industries push for more from less more speed, more efficiency, more power SiCOI films are quickly proving to be the material of the future.
Looking to enter a new market but unsure where to start? At BIS Research, we provide first-hand insights directly from key opinion leaders (KOLs), backed by rigorous primary and secondary research. Whether you're exploring opportunities in Power Devices, Semi-Insulating SiC Substrates and Conductive SiC Substrates, our segmentation-driven approach helps you tap into real market growth potential. Our strategic intelligence empowers you to make informed, confident decisions from product positioning to pricing and regulatory planning.
